IBM unveils the first chips engraved in 2 nm

IBM has just unveiled its new process for etching electronic chips in 2 nm, a world first. The firm promises almost doubled performance compared to current processors, or devices with a fourfold autonomy.

IBM has just pushed back the limits of electronics by announcing an engraving process of unequaled finesse. Its new chips, engraved in just 2 nm, will be able to contain more transistors, which improves performance.

This breakthrough is based on IBM's nanosheet technology, already used in its 5 nm process, as well as a GAA (Gate All Around) arrangement which places the gate all around the transistors. This allows it to reach a density of 333 million transistors per mm² (MTr / mm²), compared to 91 and 95 MTr / mm² for the 7 nm processors at TSMC and Samsung respectively, or 292 MTr / mm² for the all new 3 nm process at TSMC. Note that the next generation of Intel chips engraved at 7 nm should still reach 237 MTr / mm², which shows that it is not only the fineness of the engraving that determines the density of the transistors.

Electricity consumption divided by four

These new chips would present considerable gains compared to those currently on the market, mainly engraved in 7 nm. For intensive tasks, they would allow 45% more performance. Conversely, for devices whose priority is autonomy, they allow electricity consumption to be reduced by 75% for the same performance.

Note, however, that this is a simple prototype. IBM does not have its own factories and will therefore have to convince partners, such as Samsung, which currently produces IBM's Power10 processors. We should not expect to see them on the market before 2024 or 2025. These chips could quadruple the autonomy of smartphones, according to IBM, reduce the power consumption of data centers, and improve the performance of laptops and self-driving cars. . The firm is also targeting artificial intelligence, space exploration, 5G and even 6G.